New leak reveals internal heat pipe for Moto X (2016)
Although the next generation Motorola flagship, the Moto X (2016), is thought to be on track for a second half of 2016 release, the rumors and leaked images are already getting started. We have already seen one leak that revealed a radical departure may be in store from Motorola as they head down the path of a metal and glass chassis for the next version Moto X. A newly leaked image shows some innovative thinking on Motorola’s part, this time with regards to the internals of the device which appears to incorporate a heat pipe.
Heat pipes are not a new technology, but there have been few applications in mobile devices, although Samsung is reportedly looking at the same concept for the Galaxy S7. The need for some creative cooling solutions may be traced back to the Qualcomm Snapdragon 820 chip that is the rumored selection for the the Moto X (2016). Smartphone manufacturers already went through one round of heat “issues” with the Snapdragon 810.
Supposedly the Snapdragon 820 was going to avoid that situation, but thus far indications are that heat management is still a significant issue. Thus we see designers exploring solutions like heat pipes. In the case of Motorola, managing heat may also be part of the reason to shift to a metal and glass chassis design.
On a related note, sources have compared this latest leaked image with the last one and have noted the rear-facing speaker grille seems to match up between the two devices. Since this is likely an early prototype, that could still change for the final design.
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